MAGNETRON TYPE SPUTTERING ELECTRODE MAGNETIC FIELD COORDINATION AND ITS MAGNETIC CIRCUIT

PROBLEM TO BE SOLVED: To provide magnetron type sputtering electrode magnetic field coordination capable of assuring erosion over the entire surface of a target by improving the consumption efficiency of the target, and further, decreasing the defects of the films formed on a substrate with this mag...

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Bibliographische Detailangaben
Hauptverfasser: EJIMA MASAKI, SHIMIZU YOSHIMASA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide magnetron type sputtering electrode magnetic field coordination capable of assuring erosion over the entire surface of a target by improving the consumption efficiency of the target, and further, decreasing the defects of the films formed on a substrate with this magnetron type sputtering electrode magnetic field coordination. SOLUTION: The magnetic field coordination is formed between the target 1 of a magnetron type sputtering electrode and the substrate to be formed with the sputtered films by a magnet arranged on the rear surface of the target 1. The coordination of the magnetic lines of force by the magnet has a null point 4 between the substrate to be formed with the sputtered films and the target. The separatrices 5 passing this null point 4 form domes on the target 1.