CIRCUIT BOARD

PROBLEM TO BE SOLVED: To prevent pinholes of solder from being formed in lead-passing holes by forming a guide pattern continuous to connecting lands, extending in nearly the same direction as the moving direction of a circuit board with respect to a solder bath so as to touch a molten solder away f...

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Bibliographische Detailangaben
Hauptverfasser:	ICHIMURA HIDEO, TAN SUGURU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent pinholes of solder from being formed in lead-passing holes by forming a guide pattern continuous to connecting lands, extending in nearly the same direction as the moving direction of a circuit board with respect to a solder bath so as to touch a molten solder away from the lands when solder dipping. SOLUTION: A guide pattern 24 is formed on a circuit board 15 to radially expand connecting lands 18 having lead-passing holes 20 of specially large areas and extends in nearly the same direction as the moving direction of the board 15. A pair of leads 29 of an electronic component 28 are inserted into the holes 20 of the land 18 connected with solder 30 to the land 18 formed on the lower face of the board 15. The solder 30 is molten and fed to the lead 18 enough to prevent pin holes of solder from being formed in the holes 20.