MANUFACTURE OF LIGHT EMITTING DIODE AND METAL MOLD FOR THE METHOD

PROBLEM TO BE SOLVED: To prevent the influence of the shrinkage of resin when a plurality of resin lenses coupled with one another are formed by placing a plurality of light emitting diode chips containing tie bars between an upper die and a lower die, cutting the tie bars, and subjecting the workpi...

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1. Verfasser:	TATE HISAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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