MANUFACTURE OF LIGHT EMITTING DIODE AND METAL MOLD FOR THE METHOD

PROBLEM TO BE SOLVED: To prevent the influence of the shrinkage of resin when a plurality of resin lenses coupled with one another are formed by placing a plurality of light emitting diode chips containing tie bars between an upper die and a lower die, cutting the tie bars, and subjecting the workpieces to transfer molding. SOLUTION: Two lead frames 4a, 4b mounted with light emitting diode chips 5a, 5b are set in the cavities 27c, 27d in a lower die 27. The cavities 27c, 27d are so formed that a plurality of resin lenses will be coupled with one another. The lower die 27 is moved up to engage cutting edges 26a, 26b in the recesses 26c, 26d in the lower die 27. The tie bars in the lead frames 4a, 4b are thereby cut. The lower die 27 is further moved up to press bond the lead frames 4a, 4b. Then molten resin 29 is injected into recesses 25a, 25b, 27a, 27b through injection ports 26c, 25c. A certain time later, the lower die 27 is moved down, and the light emitting diode array is taken out.