EQUIPMENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To enable simple and exact regulation of the flatness of a contact bonding tool by a method wherein a heater block is brought into contact with a contact bonding tool, heaters are disposed above and below in the heater block and each heater is subjected to a temperature control...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To enable simple and exact regulation of the flatness of a contact bonding tool by a method wherein a heater block is brought into contact with a contact bonding tool, heaters are disposed above and below in the heater block and each heater is subjected to a temperature control independently. SOLUTION: A heater block 13 is made up of two parts, the upper and the lower, and a groove 13a is cut between these two parts. This groove is provided so that the temperature of the two upper and lower parts of the heater block 13 be made controllable separately, and it is allowable also to insert an insulating material in the groove 13a or to separate the heater block 13 into the two, the upper and the lower, completely. In the upper half of the heater block 13, heaters (a), (b) and (c) are disposed along the longitudinal direction of a contact bonding tool 12, and in the lower half thereof, heaters (d), (e) and (f) are disposed likewise. These heaters are subjected to a temperature control independently and discretely by a temperature control part 14 which can meet various set temperatures. By changing only the set temperature of each heater, accordingly, correction of a contact bonding surface can be executed simply and exactly. |
---|