WAFER MOUNTER

WAFER MOUNTER

PURPOSE: To obtain a wafer mounter which prevents or reduce the contamination on the rear of a semiconductor wafer with silicon and prevents the wrinkle of an adhesive tape due to the concentration of tension. CONSTITUTION: A wafer mounter is provided with a tension part which presses the adhesive f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUZUKI KAZUNARI, ABE YOSHIYUKI, KOMIYA KAZUMOTO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES
PACKING
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
STORING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE: To obtain a wafer mounter which prevents or reduce the contamination on the rear of a semiconductor wafer with silicon and prevents the wrinkle of an adhesive tape due to the concentration of tension. CONSTITUTION: A wafer mounter is provided with a tension part which presses the adhesive face of an adhesive tape 8 by a pinch roller 3A so as to give constant tension to the adhesive tape 8 and with a pasting part which pastes the rear of a semiconductor wafer 11 on the pasting region 8A in the adhesive face of the adhesive tape 8. In the wafer mounter, a noncontact region 3A1 which does not come into contact with the pasting region 8A in the adhesive face of the adhesive tape 8 is formed in the central part on the surface of the pinch roller 3A.