METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR

PURPOSE: To provide a method and an apparatus for manufacturing a semiconductor improving the uniformity of treatment characteristics such as film thickness and density in a treatment unit on a workpiece. CONSTITUTION: The apparatus for manufacturing a semiconductor comprises a cover member 5 for fo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUKADA HIROSHI, TAKAISHI MASARU, SAKA SOICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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