FIELD EMISSION CATHODE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To easily erthance adhesion strength of a resistance layer with an emitter in a simple manufacturing process. SOLUTION: A hole 114 is formed in a stacked substrate formed by forming at least a cathode electrode layer 101, a resistance layer 102, an insulating layer 103, and a gate electrode layer 104 on a substrate in order, a buffer layer 1 made of conductive material is formed on the resistance layer 102 exposed to the hole 114, an emitter cone 2 is formed on the buffer layer 1, and the adhesion strength of the resistance layer 102 with the emitter cone 2 is enhanced through the buffer layer 1.