LASER HEATING CUTTING METHOD

PROBLEM TO BE SOLVED: To improve cutting efficiency through reduction of cutting resistance without damaging chip disposing ability. SOLUTION: By applying intermittent laser heating on the surface of a slope, produced by the front cutting edge angle θ of a tool 4 in a position situated in short of t...

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Bibliographische Detailangaben
Hauptverfasser: BEPPU SEIJI, TSUNATANI TOSHIHIKO, HINO YASUNOBU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve cutting efficiency through reduction of cutting resistance without damaging chip disposing ability. SOLUTION: By applying intermittent laser heating on the surface of a slope, produced by the front cutting edge angle θ of a tool 4 in a position situated in short of the cutting work point of a material 1 to be cut, by energy to prevent residue of heat generated by heating. The efficiency of a cutting retarding material is increased by cutting the chips 5 at intervals of a specified distance in such a way that the strength of the material 1 to be cut is reduced and cutting efficiency is improved through reduction of cutting resistance without damaging chip disposing ability.