METHOD AND APPARATUS FOR WORK MANAGEMENT

PROBLEM TO BE SOLVED: To eliminate the waiting time for work arrangement by a method of management comprising controlling the locations of workpieces in stock, monitoring the progress of processes, controlling job conditions, and performing parallel management under different conditions depending on...

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Bibliographische Detailangaben
1. Verfasser: MATSUO YUSHIN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To eliminate the waiting time for work arrangement by a method of management comprising controlling the locations of workpieces in stock, monitoring the progress of processes, controlling job conditions, and performing parallel management under different conditions depending on the information thus collected. SOLUTION: A location management unit 31 controls the locations of semiconductor wafers (work) 10 in a stock unit 20. A process management unit 32 monitors the progress of a large number of processes according to wafer specifications. A condition control unit 33 indicates job conditions for the next process. An indication unit 34 informs a wafer processing unit 40 of job conditions to be set in response to the contents received from the condition control unit 33. According to this constitution, semiconductor wafers 10 of various specifications can be handled simultaneously and thus the waiting time for batch processing can be eliminated.