MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To reduce a stress exerted on an electronic component generated by a difference between a mounting board and the electronic component in their thermal expansion coefficient. SOLUTION: An electronic component 1 is made up of a body 2 and lead terminals 6. The lead terminals 6 ar...

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Bibliographische Detailangaben
1. Verfasser:	OGURA TAKETSUGU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce a stress exerted on an electronic component generated by a difference between a mounting board and the electronic component in their thermal expansion coefficient. SOLUTION: An electronic component 1 is made up of a body 2 and lead terminals 6. The lead terminals 6 are joined in cascade to external electrodes 3 formed on one end of the body 2 through high-temperature solders 5 or the like. The electronic component 1 having the body 2 and lead terminals 6 joined thereto in cascade is mounted on a mounting board 10 to be electrically connected to electrically conductive patterns 11 and 12 formed on the mounting board 10 via solders 15 and 16. In this connection, the thermal expansion coefficient of the electronic component 12 is set to be equal to that of the mounting board 10.