BGA-TYPE SEMICONDUCTOR DEVICE, AND PARTS FOR IT AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To reduce the inductance of a power system and cope with the improvement of operation speed and increase of integration degree, by arranging the wiring of the power line at the center of a BGA board thereby enabling the length of the wiring of the power line to be shortened more than the signal wiring or the number of power lines to be increased. SOLUTION: At the rear of a ball grid array(BGA) board 1, a wiring pattern 6 connected to a through hole 2 and a soldering pad 7 connected to the wiring pattern 6 are arranged, and these are used for connection of wiring. Moreover, at the center of the rear of the BGA board 1, a wiring pattern 14 connected to the through hole 12 and a soldering pad 13 connected to the wiring pattern 14 are arranged, and these are used for connection of wiring of power source or ground. The wiring pattern 14 of the wiring of the power source is widened for line width for reduction of inductance, and also the through hole 12 and the soldering pad 13 are connected with each other by a plurality of wirings. Hereby, the speedup or elevation of integration degree of a semiconductor device materialize.