PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE
PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a s...
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| creator | UTAKA YUKIHIRO |
| description | PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a superconducting film at each prescribed intervals. SOLUTION: This pad for superconducting connection use is one formed into a constitution, wherein a superconducting film 2 consisting of a superconductive material, such as Nb, is formed on a substrate 1 consisting of such a material as silicon, such as a material which is not put into a superconducting state in the state of a cryogenic temperature of several K or thereabouts, and metal films 3 having a prescribed thickness and a prescribed width are formed on this film 2 at each prescribed intervals. These films 3 are formed of a metal film having a high wettability with superconducting bonding wires. In the case where the superconducting bonding wires 4 are connected with the films 3 using the pad for superconducting connection use of this constitution, the wires 4 are brought into a state that the point parts of the wires 4 intrude into the gaps between the fellow films 3. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09139527A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09139527A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09139527A3</originalsourceid><addsrcrecordid>eNrjZLAKcHRRcPMPUggODXANcvb3cwl1DvH0c1cAMv1cgUx_P4XQYFcFRz8XBc-QYAVfR79QN0fnkNAgVx4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu8V4GFgaWhsaWpk7mhMjBoAxBkpXw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE</title><source>esp@cenet</source><creator>UTAKA YUKIHIRO</creator><creatorcontrib>UTAKA YUKIHIRO</creatorcontrib><description>PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a superconducting film at each prescribed intervals. SOLUTION: This pad for superconducting connection use is one formed into a constitution, wherein a superconducting film 2 consisting of a superconductive material, such as Nb, is formed on a substrate 1 consisting of such a material as silicon, such as a material which is not put into a superconducting state in the state of a cryogenic temperature of several K or thereabouts, and metal films 3 having a prescribed thickness and a prescribed width are formed on this film 2 at each prescribed intervals. These films 3 are formed of a metal film having a high wettability with superconducting bonding wires. In the case where the superconducting bonding wires 4 are connected with the films 3 using the pad for superconducting connection use of this constitution, the wires 4 are brought into a state that the point parts of the wires 4 intrude into the gaps between the fellow films 3.</description><edition>6</edition><language>eng</language><subject>ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970527&DB=EPODOC&CC=JP&NR=H09139527A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970527&DB=EPODOC&CC=JP&NR=H09139527A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UTAKA YUKIHIRO</creatorcontrib><title>PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE</title><description>PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a superconducting film at each prescribed intervals. SOLUTION: This pad for superconducting connection use is one formed into a constitution, wherein a superconducting film 2 consisting of a superconductive material, such as Nb, is formed on a substrate 1 consisting of such a material as silicon, such as a material which is not put into a superconducting state in the state of a cryogenic temperature of several K or thereabouts, and metal films 3 having a prescribed thickness and a prescribed width are formed on this film 2 at each prescribed intervals. These films 3 are formed of a metal film having a high wettability with superconducting bonding wires. In the case where the superconducting bonding wires 4 are connected with the films 3 using the pad for superconducting connection use of this constitution, the wires 4 are brought into a state that the point parts of the wires 4 intrude into the gaps between the fellow films 3.</description><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKcHRRcPMPUggODXANcvb3cwl1DvH0c1cAMv1cgUx_P4XQYFcFRz8XBc-QYAVfR79QN0fnkNAgVx4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu8V4GFgaWhsaWpk7mhMjBoAxBkpXw</recordid><startdate>19970527</startdate><enddate>19970527</enddate><creator>UTAKA YUKIHIRO</creator><scope>EVB</scope></search><sort><creationdate>19970527</creationdate><title>PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE</title><author>UTAKA YUKIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09139527A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>UTAKA YUKIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UTAKA YUKIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE</title><date>1997-05-27</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a superconducting film at each prescribed intervals. SOLUTION: This pad for superconducting connection use is one formed into a constitution, wherein a superconducting film 2 consisting of a superconductive material, such as Nb, is formed on a substrate 1 consisting of such a material as silicon, such as a material which is not put into a superconducting state in the state of a cryogenic temperature of several K or thereabouts, and metal films 3 having a prescribed thickness and a prescribed width are formed on this film 2 at each prescribed intervals. These films 3 are formed of a metal film having a high wettability with superconducting bonding wires. In the case where the superconducting bonding wires 4 are connected with the films 3 using the pad for superconducting connection use of this constitution, the wires 4 are brought into a state that the point parts of the wires 4 intrude into the gaps between the fellow films 3.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE |
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