PAD FOR SUPERCONDUCTING CONNECTION USE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a s...

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1. Verfasser: UTAKA YUKIHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To ensure both the superconducting connection of superconducting bonding wires with metal films and the strength of the connection of the wires with the metal films by a method wherein the metal films having a wettability with the superconducting bonding wires are formed on a superconducting film at each prescribed intervals. SOLUTION: This pad for superconducting connection use is one formed into a constitution, wherein a superconducting film 2 consisting of a superconductive material, such as Nb, is formed on a substrate 1 consisting of such a material as silicon, such as a material which is not put into a superconducting state in the state of a cryogenic temperature of several K or thereabouts, and metal films 3 having a prescribed thickness and a prescribed width are formed on this film 2 at each prescribed intervals. These films 3 are formed of a metal film having a high wettability with superconducting bonding wires. In the case where the superconducting bonding wires 4 are connected with the films 3 using the pad for superconducting connection use of this constitution, the wires 4 are brought into a state that the point parts of the wires 4 intrude into the gaps between the fellow films 3.