METHOD AND DEVICE FOR EMBOSS TAPING

PROBLEM TO BE SOLVED: To provide technology for emboss-taping consisting of making carrier tape into close contact with covering tape by mechanical bonding which eases manufacturing conditions, stablizes peel strength and reduces problems such as abnormal peeling during packaging electronic componen...

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Bibliographische Detailangaben
Hauptverfasser:	SATO TADAHIRO, YAMAMOTO HIROTATSU, YAMADA MUNEHIRO, OONO SACHIYO, ENOMOTO USUKE, SUZUKI MASAKATSU, TSUKADA KAZUKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING UNPACKING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide technology for emboss-taping consisting of making carrier tape into close contact with covering tape by mechanical bonding which eases manufacturing conditions, stablizes peel strength and reduces problems such as abnormal peeling during packaging electronic components. SOLUTION: In a device for emboss-taping electronic component, means for making a carrier tape into close contact with a covering tape is provided. A carrier tape 2 contains an electronic component 1 and a covering tape 4 covers the contained electronic component 1. A recess 5 which is roughly circular in section is provided on both sides in the direction of the width of the pocket 3 of the carrier tape 2. A projection 6 roughly circular in section is provided on both sides in the direction of the width of the covering tape 4 and is ready to fitted to the recess 5 of the carrier tape 2 by simply pressing with a predetermined pressure. The electronic component 1 is packaged by making the carrier tape 2 and the covering tape 4 into close contact by mechanical bonding.