COMPOSITE SEMICONDUCTOR SUBSTRATE

PROBLEM TO BE SOLVED: To allow a 3-dimensional layout of elements to attain a multi-function high-integrated structure by bonding laminated layers of isolated semiconductor single crystal regions on a substrate with a first glass material and bonding the semiconductor single crystal regions with the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMIMURA TATSUO, FUJII KAZUHIRO
Format: Patent
Sprache:eng
Schlagworte:
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