POWER SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a power semiconductor module which has no cracking in a substrate. SOLUTION: On an insulating substrate 1 of a power semiconductor module, electrodes 2, 3, and 4 are installed parallelly in a pattern. Semiconductor chips 5 having pads 6 are mounted on one chip 2 and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUSHIMA TADAO, KOIZUMI MASAHIRO, YAMADA KAZUJI, SHIMIZU HIDEO, KAJIWARA RYOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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