METHOD AND DEVICE FOR INSPECTING SMALL ELEMENT ELECTRICAL CHARACTERISTIC

PROBLEM TO BE SOLVED: To provide a method and a device for inspecting electrical characteristics, which is capable of efficiently performing electrical characteristic inspection. SOLUTION: This method includes the following steps: bonding a number of semiconductor chips 11 to a lead frame 1, then each semiconductor chip 11 is molded by a resin 14 for each of the lead parts 2a, 2b and 2c of the lead frame 1 extended from each semiconductor chip 11 and a number of small elements 3 are formed, then when the electrical characteristic of each small element 3 is inspected, cutting off, among the lead parts 2a, 2b and 2c extended from both sides of the small element 3, the lead parts 2b and 2c from a frame part 1a leaving one in one side of the small element 3, placing measurement electrode pins 4 to the lead parts 2b and 2c, placing a measurement electrode pin 5 to a frame part 1b connected to each lead part 2a of each small element 3 not cut off, inspecting the electrical characteristic of each small element 3 and then cutting off each remaining read part 2a.