STRUCTURE OF PACKING MATERIAL FOR TAP HOLE

PROBLEM TO BE SOLVED: To provide the structure of a packing material increased in the oxygen-free porosity at the time of tapping by prevent molten metal penetration and oversintering. SOLUTION: This structure of the packing material for a tap hole is formed of the packing material which has a two-l...

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Bibliographische Detailangaben
Hauptverfasser: YASHIMA YUKIO, YAMAUCHI TAKASHI, KUMEI TAKASHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide the structure of a packing material increased in the oxygen-free porosity at the time of tapping by prevent molten metal penetration and oversintering. SOLUTION: This structure of the packing material for a tap hole is formed of the packing material which has a two-layered structure composed of a porous on bellow lower layer consisting of particles contg. >=70wt.% Al2 O3 and having 1.0 to 2.0mm grain size and an upper layer consisting of feldspar particles having 0.5 to 2.0mm grain size or a mixture composed of feldspar particles having 0.5 to 2.0mm grain size and silica particles having 0.5 to 2.0mm grain size and is charged into the tap hole of a vessel for molten metal.