FORMING METHOD FOR MICROSTRIP ANTENNA

PROBLEM TO BE SOLVED: To decrease the production processes and to improve mass productivity of a microstrip antenna by adding a patch and ground to both variable and fixed molds of an injection molding metallic mold respectively and forming the electrodes on both sides of a dielectric substrate conc...

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Bibliographische Detailangaben
Hauptverfasser: SAKAMURA KAZUYUKI, MATSUI FUMIO, TANIGUCHI KINJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To decrease the production processes and to improve mass productivity of a microstrip antenna by adding a patch and ground to both variable and fixed molds of an injection molding metallic mold respectively and forming the electrodes on both sides of a dielectric substrate concurrently with the injection molding of the substrate. SOLUTION: A movable board 9 unified with a movable metallic mold part 10 slides on a guide 12 toward an arrow C, and the part 10 engages with a stationary metallic mold part 8 and is locked at the outer circumference of the part 8 to form a molding space 13. Thus an elastic member 8b is compressed by a degree equal to the movement of a guide pin 8a caused by the pressure of the part 10. The member 8b is also compressed by a degree equal to the movement of a guide pin 10a caused by the pressure of the part 8. In such a constitution, an injection molding device 11 is produced for molding a microstrip antenna. Then the synthetic resin to be fused is supplied into the space 13 formed in both parts 8 and 10 from the device 11. Thus a dielectric substrate is unified with a patch 1, a ground 2 and a feeding pin 5.