THIN-FILM CAPACITOR AND BOARD WITH BUILT-U//IN THIN-FILM CAPACITOR

PURPOSE: To obtain a thin-film capacitor whose impedance is reduced by using a board made of a high-melting-point metal, which is used as a decoupling capacitor, which restrains a change in the characteristic of an electronic component requiring a high-speed property and which increases the reliabil...

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Bibliographische Detailangaben
1. Verfasser:	TANMACHI HARUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: To obtain a thin-film capacitor whose impedance is reduced by using a board made of a high-melting-point metal, which is used as a decoupling capacitor, which restrains a change in the characteristic of an electronic component requiring a high-speed property and which increases the reliability of the electronic component. CONSTITUTION: A thin-film capacitor is constituted in such a way that it contains a first electrode 17 which is composed of a metal board 12 composed of Mo and of an oxidation-preventive film 16 composed of Pt and a second electrode 18 which is composed of Cr electrodes 14 and a Cu electrode 15 which are arranged and installed so as to face the first electrode 17 and that an STO film which is composed of a dielectric 13 is interposed between the electrodes.