PLATED WIRE PRODUCING DEVICE

PURPOSE: To provide a plated wire producing device capable of attaining the holding of the liq. face and the prevention of scratches. CONSTITUTION: A plated wire 1 runs in a plating soln. 3. Since plating wire holding rollers 4 and 5 of a nip roller system respectively set in flowing preventing boar...

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Bibliographische Detailangaben
1. Verfasser: SHIGETA YUICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE: To provide a plated wire producing device capable of attaining the holding of the liq. face and the prevention of scratches. CONSTITUTION: A plated wire 1 runs in a plating soln. 3. Since plating wire holding rollers 4 and 5 of a nip roller system respectively set in flowing preventing boards 6 and 7 float by the buoyancy of the plating soln. 3 flowed out into the chambers and prevent the flow out of the plating soln., the liq. face of the plating soln. 3 is held. Moreover, since the plated wire holing rollers 4 and 5 in contact with the plated wire 1 are nit rollers and are floating by the buoyancy of the plating soln. 3, the plated wire 1 is not rubbed against them through their rotation in the running direction of the plated wire in accordance with the running rate of the plated wire 1.