METHOD AND APPARATUS FOR APPLYING FILM TO LEAD FRAME OR THE LIKE

PURPOSE:To apply pressure uniformly to the surface of an insulating film, when it is pressed against a heated member, by deforming a planar member made of a material having lower hardness than the heated member depending on the level difference on the surface of heated member thereby absorbing the l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YONEMOTO TAKAHARU, SASAKI SATOSHI, KAWAMURA TOSHIO, WATABIKI TERUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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