METHOD AND APPARATUS FOR APPLYING FILM TO LEAD FRAME OR THE LIKE

PURPOSE:To apply pressure uniformly to the surface of an insulating film, when it is pressed against a heated member, by deforming a planar member made of a material having lower hardness than the heated member depending on the level difference on the surface of heated member thereby absorbing the l...

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Bibliographische Detailangaben
Hauptverfasser:	YONEMOTO TAKAHARU, SASAKI SATOSHI, KAWAMURA TOSHIO, WATABIKI TERUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To apply pressure uniformly to the surface of an insulating film, when it is pressed against a heated member, by deforming a planar member made of a material having lower hardness than the heated member depending on the level difference on the surface of heated member thereby absorbing the level difference on the surface of lead frame. CONSTITUTION:A lead frame 20 is mounted on a heat plate 1 applied with an aluminium plate 2 and punched 16 to produce an insulating film 13 which is then pressed, along with an underlying lead frame 20, by means of the heat plate 1. In this regard, the aluminium plate 2 applied to the surface of the heat plate 1 is deformed plastically according to the irregularities on the surface of the lead frame 20 caused by partial plating. Consequently, the level difference on the surface of the lead frame 20 is absorbed and a pressure can be applied uniformly to the surface of an insulating film.