BONDING METHOD AND SEMICONDUCTOR DEVICE

PURPOSE:To obtain a semiconductor device having many pins and a bonding method therefor by increasing shearing strength, i.e., the shearing force per unit area, of a compression ball having a predetermined compression diameter on an electrode of the semiconductor device thereby obtaining a predetermined shearing force while decreasing the diameter of the compression ball as compared with a conventional one. CONSTITUTION:A capillary 3 has a chamfer diameter 6 set in the range of 1.0-3.0 times of the diameter of a ball 2 and produces ultrasonic output in the range of 0.15-0.79W. The ball 2 formed at the part for introducing a metal wire 1 is pressed by the chamfer surface 5 and bonded to an electrode part 9 by applying ultrasonic wave. The compression ball 11 is deformed conically from the vicinity of upper neck end part 11a to the lower end adhesive surface 11b. Consequently, the lower part thereof is formed into a conical shape having no saddle type bulge at the part rising from the bottom face.