EQUIPMENT AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICE

EQUIPMENT AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICE

PURPOSE: To obtain equipment and a method for testing an integrated circuit device which enable easy and reliable detection of a state of contact of a probe with a pad of the device to be tested. CONSTITUTION: The equipment comprises a first dummy pad part 1 comprising conductive electrodes 1a to 1c...

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1. Verfasser: ICHIKAWA MASAHIKO
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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creator ICHIKAWA MASAHIKO
description PURPOSE: To obtain equipment and a method for testing an integrated circuit device which enable easy and reliable detection of a state of contact of a probe with a pad of the device to be tested. CONSTITUTION: The equipment comprises a first dummy pad part 1 comprising conductive electrodes 1a to 1c, a first resistor part 2 comprising resistors 2a to 2c being different in a resistance value from one another, a second dummy pad part 3 comprising conductive electrodes 3a to 3c, a second resistor part 4 comprising resistors 4a to 4c being different in the resistance value from one another and a connecting part 5 connecting the first resistor part 2 with the second resistor part 4. Probes are brought into contact with the first dummy pad part 1 and the second dummy pad part 3, and it is determined on the basis of a resistance value between the probes whether the state of contact of the pads with the probes is acceptable or not.
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CONSTITUTION: The equipment comprises a first dummy pad part 1 comprising conductive electrodes 1a to 1c, a first resistor part 2 comprising resistors 2a to 2c being different in a resistance value from one another, a second dummy pad part 3 comprising conductive electrodes 3a to 3c, a second resistor part 4 comprising resistors 4a to 4c being different in the resistance value from one another and a connecting part 5 connecting the first resistor part 2 with the second resistor part 4. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title EQUIPMENT AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICE
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