EQUIPMENT AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICE

PURPOSE: To obtain equipment and a method for testing an integrated circuit device which enable easy and reliable detection of a state of contact of a probe with a pad of the device to be tested. CONSTITUTION: The equipment comprises a first dummy pad part 1 comprising conductive electrodes 1a to 1c...

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1. Verfasser: ICHIKAWA MASAHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE: To obtain equipment and a method for testing an integrated circuit device which enable easy and reliable detection of a state of contact of a probe with a pad of the device to be tested. CONSTITUTION: The equipment comprises a first dummy pad part 1 comprising conductive electrodes 1a to 1c, a first resistor part 2 comprising resistors 2a to 2c being different in a resistance value from one another, a second dummy pad part 3 comprising conductive electrodes 3a to 3c, a second resistor part 4 comprising resistors 4a to 4c being different in the resistance value from one another and a connecting part 5 connecting the first resistor part 2 with the second resistor part 4. Probes are brought into contact with the first dummy pad part 1 and the second dummy pad part 3, and it is determined on the basis of a resistance value between the probes whether the state of contact of the pads with the probes is acceptable or not.