FILM FORMING DEVICE AND FILM FORMING METHOD

PURPOSE: To reduce the happening of defects, such as pinhole, decrease the number of exchanges of a deposition preventive plate and enable long-term continuous operation by suppressing peeling of deposited films. CONSTITUTION: A peeling preventive film is formed by sputtering of Al, etc., on the sur...

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Bibliographische Detailangaben
1. Verfasser:	OKUYAMA TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: To reduce the happening of defects, such as pinhole, decrease the number of exchanges of a deposition preventive plate and enable long-term continuous operation by suppressing peeling of deposited films. CONSTITUTION: A peeling preventive film is formed by sputtering of Al, etc., on the surface of the deposition preventive plate 11 arranged in a chamber 4. The peeling preventive film relieves the stress of the adhered film 12 formed by adhesion and deposition of metallic particles at the time of film formation on a substrate and prevents the peeling thereof. Continuous operation is made possible by further forming the peeling preventive film when the adhered film 12 is formed.