LEAD SHAPE OF ELECTRONIC PART

PURPOSE: To prevent poor soldering and also to improve exfoliation strength by a method wherein the tip of the lead to be soldered to a conductive pattern is bent to repelling direction from the conductive pattern. CONSTITUTION: A lead 3 is convexedly curved downward from the neighborhood of the intermediate part, and at least its tip part is facing upward. The state of the lead 3 which is soldered to a conductive patterns 4 that solder is adhered in such a manner that it is filled in the gap generated by the curved shape, creeping-up height H can be made high, and a notch is not formed on the boundary between the lead 3 and solder 5. When bending force works on a wiring pattern 6 in the junction of soldering between the lead 3 and the conductive pattern 4, concentration of stress is not generated because a notch is not formed, and as the creeping-up height of the tip of the lead 3 is high even when the amount of displacement per unit of solder itself is same, the amount of displacement on the tip of the lead 3 can be made large, the relative displacement caused by the bending displacement of the wiring substrate 6 is absorbed by the solder 5, and exfoliation is hardly generated.