PHOTOSETTING AND THERMOSETTING RESIN COMPOSITION

PURPOSE: To obtain a photosetting and thermosetting resin compsn. developable with a dil. aq. alkali soln., giving a film excellent in various characteristics such as wear resistance, slidability, electric insulating property and hardness and useful to form the soldering resist film of a printed cir...

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Bibliographische Detailangaben
Hauptverfasser: YODA KYOICHI, TOMOBE MASARU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE: To obtain a photosetting and thermosetting resin compsn. developable with a dil. aq. alkali soln., giving a film excellent in various characteristics such as wear resistance, slidability, electric insulating property and hardness and useful to form the soldering resist film of a printed circuit board and the insulating resin layers of various electronic parts. CONSTITUTION: This photosetting and thermosetting resin compsn. contains a resin (A) curable with active energy beams and having at least two ethylenically unsatd. bonds and a carboxyl group in one molecule, a high sensitivity photopolymn. initiator (B), a diluent (C), a thermosetting component (D) made of an epoxy compd. having two or more epoxy groups in one molecule and 2-30 pts.wt. solid lubricant (E) basing on 100 pts.wt. of the resin A. This compsn. is applied to a substrate, exposed, developed and post-cured to form a high hardness cured coating film excellent in slidability as well as wear and scuffing resistances.