FORMING METHOD OF THIN FILM AND PRODUCTION OF THIN FILM MAGNETIC HEAD

PURPOSE:To obtain such a forming method of thin films that even when thin films are laminated on a projecting or recessed part, unnecessary part does not remain at the time of patterning and the thin film has good adhesion property with films, etc., formed on or under the film. CONSTITUTION:A lower adhesion layer 2, conductive layer 3, and upper adhesion layer 4 are successively formed by vapor deposition on a substrate 1. The upper adhesion layer 4 is formed to have the same property as the lower adhesion layer 2 and is made thicker than the lower adhesion layer 2. A photoresist 12 having a specified shape formed on the upper adhesion layer 4 is used as a mask to subject part of the upper adhesion layer 4 and the conductive layer 3 to ion milling. After the photoresist 12 is removed, the upper adhesion layer 4 is used as a mask to subject the conductive layer 3 and the lower adhesion layer 2 each to chemical etching. As for the etching liquid for the conductive layer 3, the liquid is selected so as not to affect the adhesion layers 2, 4. The etching liquid for the lower adhesion layer 2 is selected so as not to affect the conductive layer 3. While the upper adhesion layer 4 is etched together with the lower adhesion layer 2, since the upper adhesion layer 4 is thicker than the lower adhesion layer 2, the upper adhesion layer 4 remains when the etching of the lower adhesion layer 2 is completed.