METALLIC MOLD FOR FORMING GLASS AND METHOD FOR FORMING GLASS PRODUCT FOR CATHODE RAY TUBE

PURPOSE: To provide a metallic mold for forming glass, excellent in mold releasability and oxidation resistance and hardly causing flaws on the glass surface by using stainless steel as a substrate, forming a specific film on the topmost surface and constituting the metallic mold. CONSTITUTION: This...

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Hauptverfasser:	WAKATSUKI HIROSHI, YANAGISAWA EIJI, TAKENAKA ATSUYOSHI, SUGIZAKI MASUO, YOSHITAKE MASARU, SEGAWA MASARU, OHASHI TOSHIHIRO, YOSHIDA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GLASS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: To provide a metallic mold for forming glass, excellent in mold releasability and oxidation resistance and hardly causing flaws on the glass surface by using stainless steel as a substrate, forming a specific film on the topmost surface and constituting the metallic mold. CONSTITUTION: This metallic mold for forming glass is constituted by using stainless steel which is preferably a martensitic steel as a substrate, and forming a film containing Ni, W, Mo and/or Co on the topmost surface. The contents of the components in the topmost surface film are preferably 40-95wt.% Ni component, 5-70wt.% W component and 0.5-40wt.% Mo and/Co components in the topmost surface film. A thin film consisting essentially of one or more elements selected from groups VIII, IX, X and XI elements of the periocdic table (e.g. an Ni-Pd layer) is preferably held between the stainless steel substrate and the topmost surface film.