PRINTED BOARD HOLDING STRUCTURE

PURPOSE:To provide a printed board holding structure, wherein even if the holding structure is used for an electronic equipment, such as a TV and a VTR, which is used at an environmental temperature which largely changes, a solder crack is not generated in the soldered part of the pawl part of a fra...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OTSUBO KATSUYUKI, OGAMOTO KAZUTOSHI, KINUYAMA HIROTO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a printed board holding structure, wherein even if the holding structure is used for an electronic equipment, such as a TV and a VTR, which is used at an environmental temperature which largely changes, a solder crack is not generated in the soldered part of the pawl part of a frame body to a printed board. CONSTITUTION:A printed board holding structure is provided with a frame body 10, which is vertically opened and has a pawl part 13, which is extended from one part of the frame body 10 to the upper part or lower part of the frame body 10 and is formed in a width equal to roughly the plate thickness component of the frame 10, and a printed board 17, which has a through hole 18 formed therein, has a soldering pattern 19 on the periphery of the hole 18 and is mounted within the frame body 10, the pawl part 13 is inserted in the hole 18 in a state that the surface, which is provided with the pattern 19, of the board 17 is faced the side of the point of the pawl part 13, and the pawl part 13 is soldered to the pattern 19.