VISUAL INSPECTION METHOD FOR ELECTRONIC DEVICE

PURPOSE:To obtain visual inspection method for electronic device by which a solder bridge between the electrodes of an electronic device mounted on a board can be inspected optically and automatically. CONSTITUTION:A two electrode rectangular electronic device 73 is observed by means of a camera and...

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1. Verfasser:	TOKURA NOBUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain visual inspection method for electronic device by which a solder bridge between the electrodes of an electronic device mounted on a board can be inspected optically and automatically. CONSTITUTION:A two electrode rectangular electronic device 73 is observed by means of a camera and scanning lines 79, 79a, 79b are set between the electrodes in order to inspect a solder 78 present on the scanning line 79, 79a or 79b. If a solder 78 is found, a decision is made that a solder bridge is present thus deciding that the soldered state is not acceptable.