LAMINATED SEMICONDUCTOR PACKAGE

PURPOSE: To reduce noise of a package while enhancing the switching rate by applying a conductive film to the bottom surface of an exposed semiconductor chip at the lower part of a semiconductor package and connecting the conductive film with the ground line of a printed circuit board. CONSTITUTION:...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KEN NEIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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