LAMINATED SEMICONDUCTOR PACKAGE

PURPOSE: To reduce noise of a package while enhancing the switching rate by applying a conductive film to the bottom surface of an exposed semiconductor chip at the lower part of a semiconductor package and connecting the conductive film with the ground line of a printed circuit board. CONSTITUTION: The stacked semiconductor package 200 comprises a plurality of semiconductor packages 20. The leads 22 of the lowermost layer, i.e., the first layer, semiconductor package 20 are connected through solders 91 with a circuit pattern 43 formed on the upper surface of the frame 40 of the first layer. A conductive film 25 is formed on the bottom surface of a semiconductor chip 21 and connected with the ground terminal of the frame 40. The leads 22 of a second layer semiconductor package 20 are connected through the solders 91 with the circuit pattern 43 formed on the upper surface of the frame 40 of the first layer. The semiconductor packages 20 of third and fourth layers are connected similarly. The circuit pattern 44 on the first frame 40 is surface mounted on the land pattern 82 of a printed circuit board 80 through the solder 91.