SEMICONDUCTOR DEVICE

PURPOSE:To protect a semiconductor main body against chipping so as to protect a chipping protector against disconnection caused by overetching in a semiconductor manufacturing process. CONSTITUTION:Semiconductor main bodies 3 are formed like a lattice on a semiconductor substrate. Furthermore, a chipping protector 2 is formed on the same semiconductor substrate along a direction in which the semiconductor substrate is cut, surrounding the semiconductor main bodies 3. A disconnection protection 1 is formed like a ladder in a groove located between the semiconductor main body 3 and the chipping protector 2 so as to link the main body 3 and the chipping protector 2 together. The disconnection protection 1 not only lessens the groove in length but also enables overetching that causes disconnection to the chipping protector 2 to occur less. By this setup, the semiconductor main body 30 can be protected against chipping caused by the disconnection of the chipping protector 2.