PACKING STRUCTURE OF SEMICONDUCTOR PACKAGE

PURPOSE: To reduce the noise of a semiconductor package, and at the same time, provide the packing structure of the semiconductor package for speeding up the operation of the semiconductor package, by reducing the entire impedance of a packaged semiconductor. CONSTITUTION: A packaging structure is m...

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Bibliographische Detailangaben
Hauptverfasser:	SOU EIKI, KANEMASA YASU, SOU NEISAI, KEN NEIDO, RI TAKAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE: To reduce the noise of a semiconductor package, and at the same time, provide the packing structure of the semiconductor package for speeding up the operation of the semiconductor package, by reducing the entire impedance of a packaged semiconductor. CONSTITUTION: A packaging structure is made of a die pad 23 of a semiconductor package 20, a printed circuit board 38 where a conductive pattern 32 is formed on the surface of a region that corresponds to the die pad, and a dielectric thin film 31 or a conductive layer formed between both terminals of the die pad and the conductor pattern. Also, both terminals are electrically connected in parallel so that a voltage difference can be generated or cannot be generated between the terminals.