METAL PLATING MASK PATTERN

PURPOSE:To form in uniform film thickness a metal plating mask pattern used as a light shielding layer at the time of exposing a resist layer in a resist pattern forming stage. CONSTITUTION:A dummy pattern part 14 consisting of a metal plating part 15 and a non-plating part 16 are provided at a peri...

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Bibliographische Detailangaben
Hauptverfasser:	ASAKA KENJI, KUBOZONO KENICHI, UMEDA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPARATUS THEREFOR CHEMISTRY CINEMATOGRAPHY ELECTROFORMING ELECTROGRAPHY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To form in uniform film thickness a metal plating mask pattern used as a light shielding layer at the time of exposing a resist layer in a resist pattern forming stage. CONSTITUTION:A dummy pattern part 14 consisting of a metal plating part 15 and a non-plating part 16 are provided at a periphery of a working-effective pattern part 10 in which a pattern corresponding to a resist pattern is formed by metal plating. A dimensional change of the pattern is prevented, and a high precision metal plating mask pattern is obtained even if a substrate has large area. A high precision fine pattern can be formed efficiently by patterning a photo resist layer by using such a metal plating mask pattern.