SEMICONDUCTOR DEVICE

PURPOSE:To provide a package-shaped semiconductor device improved in heat radiating effect without changing its size. CONSTITUTION:The title semiconductor device 1 is composed of a semiconductor chip 2 mounted on a tab 3, an external lead-out lead 5, a wire 4 which connects the electrode pad (not shown in the diagram) provided on the semiconductor chip 2 and the external lead-out lead 5, and a package 6 which resin-seals the semiconductor chip 2, an inner lead and a wire 4, and a granulated or powderly heat radiating material 7 is provided on the semiconductor chip 2. The grains of powder of substance of high coefficient of thermal conductivity such as the metal powder or gold, silver, copper and the like, for example, or the metal oxide such as aluminum oxide, or a nitride such as silicon nitride is used as heat radiating material. This heat radiating material 7 is filled in a container 7a, and the material 7 is adhered to the surface of the semiconductor chip together with the container. The container 7a is also formed with the material of high coefficient of thermal conductivity. A metal plate 8 is used as the sealing material of the container 7a.