TAB PACKAGE

PURPOSE:To provide a TAB package capable of transmitting a signal at a high speed and also reducing electric noise. CONSTITUTION:As shown in Fig. 1(a), a wiring 101 having an area to which a plurality of integrated circuit chips 103, 104 are mounted and a wiring 105 connecting therewith are repeated...

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Bibliographische Detailangaben
Hauptverfasser:	CHIBA TSUNEYO, SAITO TATSUYA, HAMANAKA NAOKI, SHINTANI YOICHI, NAKANISHI KEIICHIRO, TACHIBANA MASARU, ITO MASANAO, NAKAGOME YOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a TAB package capable of transmitting a signal at a high speed and also reducing electric noise. CONSTITUTION:As shown in Fig. 1(a), a wiring 101 having an area to which a plurality of integrated circuit chips 103, 104 are mounted and a wiring 105 connecting therewith are repeatedly formed on a tape film 102. The integrated circuit chips 103, 104 are continuously connected, and thereafter the tape film is cut off by a cutoff part 106, and as shown in Fig. 1(b), the wiring 101 is connected with a package 107. At this time, it is unnecessary to transmit the signal between the chips 103 and 104 via pins of a package or the wiring of a substrate, and it is possible to connect via the wiring 105 on the film, and it is possible to transmit the signal with a short delay period and reduce electric noise.