METHOD FOR APPLYING POLYIMIDE PRECURSOR COMPOSITION TO SEMICONDUCTOR SUBSTRATE

PURPOSE:To provide a spin-coating method capable of forming a polyimide resin film having a uniform film thickness up to the end section of the surface of a semiconductor substrate. CONSTITUTION:On the occasion of spin-coating the surface of a semiconductor substrate with a polyimide precursor compo...

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Bibliographische Detailangaben
1. Verfasser:	SEKINE HIROYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a spin-coating method capable of forming a polyimide resin film having a uniform film thickness up to the end section of the surface of a semiconductor substrate. CONSTITUTION:On the occasion of spin-coating the surface of a semiconductor substrate with a polyimide precursor composition, a nitrogen gas is blown to the center part of the surface of the semiconductor substrate from a pipe 6, to the upside of the polyimide precursor composition 4 dripped to the center part, rotating the substrate. After the stop of the nitrogen gas blowing, the semiconductor substrate is moreover rotated and coated with the polyimide precursor composition.