HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION
Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.
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| creator | EDOGAA OSUTORININGU AJIZU ERUUZAIIDO RARUFU RANGE ANDOREASU GITEINGAA |
| description | Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH08333511A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH08333511A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH08333511A3</originalsourceid><addsrcrecordid>eNrjZLD3cHUM0Q0OcXTycVVw9HNRCAfyPVyDdINcgz2Bwn4hCgH-PpGOvp4urgq-_j4unn7uCs7-vgH-wZ4hnv5-PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3ivAw8DC2NjY1NDQ0ZgYNQCc3irR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION</title><source>esp@cenet</source><creator>EDOGAA OSUTORININGU ; AJIZU ERUUZAIIDO ; RARUFU RANGE ; ANDOREASU GITEINGAA</creator><creatorcontrib>EDOGAA OSUTORININGU ; AJIZU ERUUZAIIDO ; RARUFU RANGE ; ANDOREASU GITEINGAA</creatorcontrib><description>Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.</description><edition>6</edition><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19961217&DB=EPODOC&CC=JP&NR=H08333511A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19961217&DB=EPODOC&CC=JP&NR=H08333511A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EDOGAA OSUTORININGU</creatorcontrib><creatorcontrib>AJIZU ERUUZAIIDO</creatorcontrib><creatorcontrib>RARUFU RANGE</creatorcontrib><creatorcontrib>ANDOREASU GITEINGAA</creatorcontrib><title>HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION</title><description>Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3cHUM0Q0OcXTycVVw9HNRCAfyPVyDdINcgz2Bwn4hCgH-PpGOvp4urgq-_j4unn7uCs7-vgH-wZ4hnv5-PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3ivAw8DC2NjY1NDQ0ZgYNQCc3irR</recordid><startdate>19961217</startdate><enddate>19961217</enddate><creator>EDOGAA OSUTORININGU</creator><creator>AJIZU ERUUZAIIDO</creator><creator>RARUFU RANGE</creator><creator>ANDOREASU GITEINGAA</creator><scope>EVB</scope></search><sort><creationdate>19961217</creationdate><title>HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION</title><author>EDOGAA OSUTORININGU ; AJIZU ERUUZAIIDO ; RARUFU RANGE ; ANDOREASU GITEINGAA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH08333511A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>EDOGAA OSUTORININGU</creatorcontrib><creatorcontrib>AJIZU ERUUZAIIDO</creatorcontrib><creatorcontrib>RARUFU RANGE</creatorcontrib><creatorcontrib>ANDOREASU GITEINGAA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EDOGAA OSUTORININGU</au><au>AJIZU ERUUZAIIDO</au><au>RARUFU RANGE</au><au>ANDOREASU GITEINGAA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION</title><date>1996-12-17</date><risdate>1996</risdate><abstract>Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION |
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