HEAT-STABLE AND WEATHER-RESISTANT POLYAMIDE MOLDING COMPOSITION

Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.

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Bibliographische Detailangaben
Hauptverfasser:	EDOGAA OSUTORININGU, AJIZU ERUUZAIIDO, RARUFU RANGE, ANDOREASU GITEINGAA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Thermoplastic polyamide moulding materials (I), contg. as stabiliser a mixt. of (a) copper halide, (b) halogen cpd(s). and (c) hypophosphorous acid or an alkali or alkaline earth salt thereof, in amts. such that (I) contains 6-15 moles halogen per mole Cu and 1-10 moles phosphorus per mole Cu.