FLEXIBLE PRINTED-WIRING BOARD
PURPOSE: To increase the adhesion of a copper film to a polyimide film after a heat load and after an electroless plating by a method wherein a first deposited metal layer selected from among metal layers consisting of materials of thicknesses in a specified range is provided on the polyimide film c...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE: To increase the adhesion of a copper film to a polyimide film after a heat load and after an electroless plating by a method wherein a first deposited metal layer selected from among metal layers consisting of materials of thicknesses in a specified range is provided on the polyimide film containing a specified amount of tin, then, a second deposited layer consisting of the copper film is provided on the first deposited metal layer. CONSTITUTION: A first deposited metal layer B selected from among metal layers consisting of materials of thicknesses in a range of 10 to 300 including the thickness of a mixed layer consisting of all deposited metals mixed in a polyimide film, a second deposited layer C consisting of a copper film and a copper-plated layer D are laminated in order on one surface of the polyimide film A, which is performed a surface treatment and contains the amount of tin of 0.02 to 1 wt. %. As the characteristics of the metal layer constituting the layer B, one to strengthen the adherence of the polyimide film to the layer C, there is no diffusion of the metal layer due to heat and the metal layer is firm, the metal layer is good in chemical resistance and heat resistance and the like are important. Therefore, it is desirable that one kind of an element or more than one kind of elements selected from a group consisting of nickel, chrome, cobalt, palladium and the like is/are used for the metal layer. |
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