PROBE FOR WIRELESS FILM THICKNESS METER LOWERED IN POWER CONSUMPTION

PURPOSE: To provide a thickness measuring apparatus for a surface treated film of metal plate which eliminates damage to a cable between a body and a probe. CONSTITUTION: This probe 21 for a film thickness measuring device to measure the thickness of a film on metal has a film thickness measuring se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	YUKI HIDEYASU
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SIGNALLING TARIFF METERING APPARATUS TESTING TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILARSIGNALS
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Beschreibung
Zusammenfassung:	PURPOSE: To provide a thickness measuring apparatus for a surface treated film of metal plate which eliminates damage to a cable between a body and a probe. CONSTITUTION: This probe 21 for a film thickness measuring device to measure the thickness of a film on metal has a film thickness measuring section 31 to which a power source voltage is supplied by a first switch SW1, a control section 38 to turn on a third switch SW3 for supplying the power source voltage with a second switch SW2 to be turned on by a film thickness measuring operation and a data transmitting section to which the power source voltage is supplied by turning on the third switch SW3 to transmit film thickness measuring data. The control section 38 turns off the third switch SW3 after the transmission of measurement data from the data transmitting section.