COVER FILM PEELING METHOD FOR DRY FILM

PURPOSE: To easily and surely peel a cover film protecting a dry film stuck to a substrate by peeling the cover film from the substrate along the extension direction of a diagonal line of opening sections formed on the substrate. CONSTITUTION: Part of a cover film 2 stuck to a copper-clad laminate i...

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Bibliographische Detailangaben
1. Verfasser:	FUJINAKA HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: To easily and surely peel a cover film protecting a dry film stuck to a substrate by peeling the cover film from the substrate along the extension direction of a diagonal line of opening sections formed on the substrate. CONSTITUTION: Part of a cover film 2 stuck to a copper-clad laminate is peeled. For peeling part of the cover film 2, part of an adhesive tape having the strength stronger than the adhesive strength of the cover film 2 and a photo- resist 4 is stuck to a comer section of the copper-clad laminate, and part of the cover film 2 can be turned over when the adhesive tape is again lifted. The cover film 2 is peeled in the direction of a diagonal line of opening sections 3 formed on the copper-clad laminate. The opening sections 3 are formed on the copper-clad laminate to mount semiconductor chips, and they are formed into a square shape at one or multiple positions on the copper-clad laminate.