FABRICATION OF SEMICONDUCTOR DEVICE

PURPOSE: To provide a method for fabricating a semiconductor device in which the contact of multilayer interconnection is stabilized. CONSTITUTION: An insulating film 2 is deposited on a first layer aluminum interconnection 1 and a resist mask 3 for making a contact hole is formed on the insulating...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OGURA TAKEISA, BITO YOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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