RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE: To obtain a resin sealed semiconductor device in which the manufacturing time is shortened significantly and the manufacturing facility is reduced by decreasing the manufacturing steps of the semiconductor device and the reliability is enhanced by suppressing contamination to the lead frame and semiconductor element. CONSTITUTION: The resin sealed semiconductor device comprises a plurality of leads 6 connected electrically with a semiconductor element 1, bump electrodes 10 formed on an outer electrode 5 or the lead, and a resin molding for sealing a part of the plurality of leads, the bump electrodes and the semiconductor element. The plurality of leads are pressed at the forward ends thereof while being superposed on the major surface of the semiconductor element through the bump electrodes 10 and the leads 6 are connected electrically with the outer electrode under that state. With such an arrangement, stable electrical connection is realized between the lead 6 and the outer electrode 5.