TRAY FOR IC

PURPOSE: To provide a tray for IC having a destaticizing effect, capable of stacking and containing, stocking and conveying an IC chip by forming the part in direct contact with the chip of carbon conductive filler-containing resin, and forming at least part of the outside of the peripheral wall of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIZUTANI TOSHIKAZU, OGAMI MASAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE: To provide a tray for IC having a destaticizing effect, capable of stacking and containing, stocking and conveying an IC chip by forming the part in direct contact with the chip of carbon conductive filler-containing resin, and forming at least part of the outside of the peripheral wall of a tray of resin having different color from that of the chip. CONSTITUTION: One of the material used for a tray for an IC is carbon conductive filler and resin composition A containing various thermoplastic resin, and the other is destaticized resin composition B having different color from that of the composition A. The tray 1 for the IC has a bottom plate 2, a peripheral wall 3, ribs 4 for partitioning the upper surface of the bottom plate, and recesses 5 in which the chips are mounted and contained, which are formed of the composition A to exhibit black. The part 6 having different color present at the part of the outer surface of the wall 3 is formed of the composition B. As a method for manufacturing the integral molding by the two types of the compositions A, B, a two-color injection molding method which is normally conducted is preferable.